集成RF提供容易進(jìn)入物聯(lián)網(wǎng)節(jié)點發(fā)展

　　可以說，物聯(lián)網(wǎng)目前正在經(jīng)歷一些“成長的痛苦”方面，它做（或不）包括。雖然它可能不會被視為驅(qū)動的趨勢，嵌入式電子行業(yè)肯定使它，無疑是在一個制高點的形狀。

　　一些在這個行業(yè)誰懂技術(shù)在最外面的一個水平不覺得物聯(lián)網(wǎng)將是更大的東西的一個子集：一切的互聯(lián)網(wǎng)；但除了語義明確的機(jī)會是巨大的，估計高達(dá)2020 500億的設(shè)備，甚至有人預(yù)測2025打1兆。

　　Given that many of those devices will be small nodes on larger networks， the Bill of Materials will need to be small in terms of components and total cost. For this reason it follows that every node， however big or small， will have at its heart some form of microcontroller. Given the pressure developers will be under to keep the BoM as low as possible， it seems probable that they will be selecting only those MCUs that offer the right combination of features within their price and power budget.